Controlling placement load

With the proliferation of very small parts and thin panels, the placement process has become ever more delicate. As components become lighter, thinner, and smaller, and panels are more easily deformed than ever before, the slightest change in conditions can affect placement quality.

Placing parts with high accuracy

In addition to the advancement of smaller electronic parts and more complex electronic circuit designs, growing needs for finer pitch placement is making filletless soldering more popular. A small amount of solder is applied when performing fine pitch placement using very small sized chip parts, which makes it difficult to expect such parts to be applicable for self-alignment effects. Instead, producing accurate part placement to put parts in a definitive place is required.
The following introduces positioning techniques for achieving highly accurate placement.

Preventing defective pickup and placement

To keep the productivity high, factors that cause defects must be detected and eliminated through accurate recognition of the part state in a series of processes from pickup to placement.
The following introduces checks on part states for pickup and placement.

Increasing productivity

An increasing number of manufacturing sites have been required to support high-mix low-volume production. The SMT production sites in particular must also respond to rapid changes in electronic boards.

Automation and labor-saving

We are aware that our customers are addressing improvements every day while facing the need to balance both the turnaround time and cost with limited resources at SMT sites. Some of you may feel that it is difficult to keep up through the conventional means.

Improving changeover efficiency

Improving solder paste print quality

Are printing instabilities keeping your company from reaching it's true production potential? We will focus on "stability" in particular and introduce solutions that are highly effective in maintaining stable print quality in this presentation.

Improving parts placement quality

There are a lot of factors that lead to placement defects. Quality can vary greatly depending on factors such as part pickup and panel warpage. Fuji offers a variety of solutions that are highly effective in reducing the defect rate. They are all proven solutions proposed by our dedicated engineers for on-site improvement services.

Maintaining and improving quality

"We are wanting to improve quality, but are not seeing any results." "We have put measures in place, but productivity dropped." Is your production site facing any such quality-related problems? Fuji provides solutions for maintaining and improving quality without sacrificing productivity.

Excluding future defects attributed to parts

Highly accurate and functional placement machines do not always result in defect free production if the part to be placed is the source of the problem. To maintain high quality, it is very important to control production so that defective parts are not used, just as it is important to ensure good pickup and placement processes.
The following introduces applications to reliably detect defective parts and incorrect parts, and eliminate their usage.

Preventing drops in machine performance

Pickup errors and contact issues may occur in association with adherence of solder paste and dust from the panels and carrier tape. To avoid any loss of production from these factors, it is necessary to keep the feeders, nozzles, and heads that are directly related to picking up and placing parts in top condition. The following introduces functions and units to cover this objective.