Quality | FUJI SMT Site

Preventing defective pickup and placement

To keep the productivity high, factors that cause defects must be detected and eliminated through accurate recognition of the part state in a series of processes from pickup to placement.
The following introduces checks on part states for pickup and placement.

Placing parts with high accuracy

In addition to the advancement of smaller electronic parts and more complex electronic circuit designs, growing needs for finer pitch placement is making filletless soldering more popular. A small amount of solder is applied when performing fine pitch placement using very small sized chip parts, which makes it difficult to expect such parts to be applicable for self-alignment effects. Instead, producing accurate part placement to put parts in a definitive place is required.
The following introduces positioning techniques for achieving highly accurate placement.

Controlling placement load

To be able to maintain quality when placing electronic parts that are increasingly smaller, thinner, and lighter, it is necessary to have a high level of stopping accuracy as well as low load on the parts when placing them. Low impact placement is a prerequisite for controlling the load on parts and solder.
The following introduces mechanical features of our products to deliver low impact placement and also sensing technologies for placing parts at an appropriate height while securing stable tackiness with the panel in mind.

Excluding future defects attributed to parts

Highly accurate and functional placement machines do not always result in defect free production if the part to be placed is the source of the problem. To maintain high quality, it is very important to control production so that defective parts are not used, just as it is important to ensure good pickup and placement processes.
The following introduces applications to reliably detect defective parts and incorrect parts, and eliminate their usage.

Preventing drops in machine performance

Pickup errors and contact issues may occur in association with adherence of solder paste and dust from the panels and carrier tape. To avoid any loss of production from these factors, it is necessary to keep the feeders, nozzles, and heads that are directly related to picking up and placing parts in top condition. The following introduces functions and units to cover this objective.