With the arrival of 5G compatible devices, there is an increased need for high-density boards like those used in high-end smartphones. 5G compatible devices require space for a greater quantity of components, and increased battery capacity. This leads to a requirement for the main board to be even more compact. Interposers are being employed as a new method for achieving high density placement. These interposers are sandwiched between two main boards for a two-tiered board.

Interposers have bumps on both sides of the part, which often results in air leaks when the parts are picked up. Because of this, parts with air leaks need to be conveyed at reduced speed, resulting in a bottleneck at the SMT stage.

The air route has been changed on the newly developed H01V head. This head enables both stable pickup and high-speed placement of interposers. A large volume of air taken from upstream on the module is connected directly to the head, to achieve four times the part retention power in comparison to the previously often-used H01 head. By using this head together with a dedicated design nozzle, interposers can be placed at high speed.

H01V heads can be used for parts other than interposers for handling with greater stability and speed for transporting, contributing to greater productivity for the entire line.

Please contact us if you have any further questions about this solution.