Place interposers at high-speed with a high-powered vaccum placement head
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With the arrival of 5G compatible devices, there is an increased need for high-density boards like those used in high-end smartphones. 5G compatible devices require space for a greater quantity of components, and increased battery capacity. This leads to a requirement for the main board to be even more compact. Interposers are being employed as a new method for achieving high density placement. These interposers are sandwiched between two main boards for a two-tiered board.
Interposers have bumps on both sides of the part, which often results in air leaks when the parts are picked up. Because of this, parts with air leaks need to be conveyed at reduced speed, resulting in a bottleneck at the SMT stage.
Pickup surface on interposer that causes losses in productivity
Because bumps are also on the part pickup surface, there are areas where there is a gap between the nozzle and the part and thus the hold during pickup is unstable.
Place interposers at high speeds with high-powered vacuum placement heads
H01V head
RH01 head
The head structure with an improved vacuum flow rate enables stable pickup and high-speed placement of interposers.
When combined with dedicated nozzles, efficient and reliable transport is attained. The following video shows an example of placements using the H01V head.
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Video for Interposer placement using H01V
H01V and RH01 heads can be used for parts other than interposers for handling with greater stability and speed for transporting, contributing to greater productivity for the entire line.
Head Specifications
| H01V | RH01 | |
| Applicable machines | NXT M6 III, M6 IIIc (Note 1) | NXTR S model, NXTR A model |
| Nozzle quantity | 1 | 1 |
| Supported part size | 1608 (0603") to 74 x 74 mm (32 x 162) | 1608 (0603") to 200 x 150 mm |
| Supported part height | 25.4 mm | 38.1 mm (Note 2) |
| Premounted part height | 25.4 mm | 38.1 mm |
| Placement accuracy | ±0.03 mm cpk≧1 | ±0.025 mm cpk≧1 |
| Throughput | 4,000 CPH | 5,200 CPH |
| Supported host system | Nexim | Nexim |
| Note 1: Air piping that supports H01V heads is required on the machine side.
Note 2: This changes depending on the diagonal size. |
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