Flexible printed circuits (FPC) are very thin with properties that allow them to be bent to a desired angle for use in electronics with movable parts and interfolded structures, and in three-dimensional wiring in devices with small interior spaces such as smartphones and wearables.

However, while FPC are well-suited to these purposes, it is harder to maintain production quality during SMT processes for these panels. FPC are made from layers of thin, pliable, film-like materials. Polyimide film layers make up most of the material, together with layers of copper foil, and bonding between materials and sputtered layers. All these materials have differing degrees of shrinkage, making FPC prone to warpage and changes in dimensions while used during production. Also, with variances in accuracy for the lamination of materials, the positioning and shape of lands are prone to changing, leading to deviated solder printing and part placement. Normal placement based on CAD data is not adequate for responding to changes in dimensions and changes in positioning per manufacturing lot caused by warpage of materials.

This article presents Fuji’s target on paste (TOP) placement solution that utilizes the effects of self-alignment, and is effective for preventing defective placements on FPC caused by the aforementioned positioning deviations.

■ The land positions do not match the CAD coordinates or Gerber data
　
The expansion and contraction of materials causes the land positions to shift, resulting in deviations from the positions designated by the CAD coordinates or the Gerber data.


■ The reference position is deviated because of changes in the shape for fiducial marks

Part placement positions deviate due to fiducial mark shape changes and mark center position deviations caused by interference from resist and coverlay layers.


■ The position of the FPC on the carrier board is deviated

The attachment positions on the carrier boards vary because FPC are usually transferred to carrier boards by hand.

For the reasons given above, the relative positions between lands, solder, and parts deviate, leading to differences in the contact area between part terminals and solder. If parts do not have balanced solder contact, when the solder melts there will be greater pull applied on the part on one side than the other, causing the part to become skewed or tombstoned.

By taking an image of the solder printed on the FPC using the camera in the pick and place machine and using that image to adjust the part placement position, parts can be placed on the center of the solder without needing to be concerned about deviated land positions or deformed fiducial marks. Because the part terminals are contacting an even volume of solder, the self-alignment phenomena is used to maximum effect, for more stable part positioning.

Self-alignment when using TOP placement is very effective for small rectangular chip parts that are 1005 (0402") or smaller, and thus is suitable for the following types of panels.

· Panels that use many small chip parts
· Panels with placements on both sides
· Panels that require the use of carrier boards

Placement quality is improved, reducing wasteful disposal and repair work.

Note that there are cases in which the desired result cannot be achieved depending on the state of the panel and the degree of positional deviation.

TOP実装は、装置カメラで印刷位置を確認するモジュール完結型ソリューションのため、装置間の画像処理の違いによる影響はありません。そのため、導入に伴う周辺装置の置き換えや装置の改造は必要なく、低コストで導入できます。

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