Small components | FUJI SMT Site

Placement Solutions for Packages Including SiP and Other Module Parts

Fuji provides an array of solutions for manufacturing SiP and other module parts. We will be looking at solutions for higher density placements and thinner structures using Fuji functions and units.

Improving Placement Quality on Flexible Printed Circuits | Introducing Target On Paste (TOP) Placement

Fuji’s target on paste (TOP) placement solution that utilizes the effects of self-alignment, and is effective for preventing defective placements on FPC caused by the aforementioned positioning deviations.

Maintaining High Quality amid Changes in SMT for Increasingly Complex Electronic Panels

This article will cover three areas that are important to improving quality in SMT processes and maintaining a high level of QCD, "Sure-fire pickup and placement", "Eliminating defective materials", and "Proper maintenance" with supporting data.