Do you have trouble with deviated or dropped parts in the reflow process, or poor joints due to insufficient solder paste?
The RHGL head is a dispensing head that can be used on Fuji's NXTR placement machines by simply exchanging the placement head.
Glue and solder paste are applied with high accuracy to the required locations, reducing defects and stabilizing quality.
Capabilities of the RHGL Head
■ Prevents reflow defects
Temporarily fix heavy or tall parts with adhesive to
prevent deviations or drops during reflow for the second side.
■ Reduces defects due to insufficient solder paste
Before placing a part, apply an additional amount of solder paste to areas that are prone to solder paste shortage.
This ensures stable bonding strength.
■ No special dispenser required
NXTR can be utilized as a dispenser.
Even with infrequent application production, capital investments can be reduced.
Checks and corrections to support stable quality
• Detects panel warpage and automatically corrects application height
• Measures dispensing diameter and automatically optimizes
• Detects defects such as no glue and stringing
Stable dispensing quality can be maintained, even with variations in panel conditions.
VIDEO
Basic Specifications
| Supported machines | NXTR S model (1R module, 2R module, 2RV module) NXTR A model (1R module, 2R module) |
|---|---|
| Application solutions | Adhesive, solder paste |
To reduce defects and improve production efficiency while making the most of your existing equipment, download the fact sheet.
