Against a backdrop of demand for product miniaturization and minimization of occupied spaces, the instances of parts being placed at high-density, ultra-small chip parts, and small CSPs with fine bumps are increasing. On the other hand, there is also demand for larger BGAs and larger panels to enable higher functionality and function integration.
This presentation will explain how Fuji’s pick and place machines cater to the simultaneously advancing diversification of electronic panels and increasing difficulty in parts placement processes due to a higher level of sophistication.