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SiP and package production

Have you ever had the following issues?

- Decrease of production efficiency due to many placements
- Limitations in the support capacity for placements such as fine pitch placements
- Deterioration of quality due to the impact force on parts and solder paste

Fuji provides various approaches to meet requests to increase production efficiency, to support various parts and panels, to stabilize quality, and to solve the various problems in SiP and package placement.

Find a comprehensive summary of our major solutions in the solution proposal document below.
We hope you will check it out.

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Related information

Products

NXTR S model

NXTR offers a truly modular design for the optimal line configuration that caters to your production.
Real-time sensing placement, optimized placement actions, and part handling checks after placement are just a few examples. This high end model machine supports new functions that preserve a high level of QCD performance.

NXTR is the next stage toward the smart factory of the future.

Products

NXTR A model

Fuji is paving the way to the future of Smart Factories with NXTR.

The accompanying Smart Loader frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity.

Products

NXT-H

Wafer and reel part placement in a single unit.
Supports tray part and reel part placement as well as direct pickup from wafers.

Useful Information

Placement Solutions for Packages Including SiP and Other Module Parts

Fuji provides an array of solutions for manufacturing SiP and other module parts. We will be looking at solutions for higher density placements and thinner structures using Fuji functions and units.

Useful Information

Maintaining High Quality amid Changes in SMT for Increasingly Complex Electronic Panels

This article will cover three areas that are important to improving quality in SMT processes and maintaining a high level of QCD, "Sure-fire pickup and placement", "Eliminating defective materials", and "Proper maintenance" with supporting data.

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