SiP and module parts
As electronics become smaller with greater functionality and along with demand driving shorter development times, there is an increased demand for package parts such as SiP and module parts. There are many different configurations of package parts that can be found in the market, but the common threads in the manufacturing process of these parts; multi-layering and thinner structures in the Z direction, and higher density in the XY direction, are being used in combination and continue to evolve. For these kinds of cutting-edge processes, Fuji is on hand to talk directly with factories to talk shop and provide an array of solutions.
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