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Automation made possible by FUJI Smart Factory – Case Study: Takaya Corporation

Takaya Corporation (Est. 1894, Okayama Prefecture) is a company with a long history in various electronics industries both in Japan and overseas. In recent years, Takaya has been focusing on reducing the time required for product changeover and searching for production materials, especially in the context of high-mix, low-volume production. In 2021, Takaya introduced FUJI Smart Factory (FSF) with its combination of system and automation technologies. As a result, product changeover and parts supply within the SMT line were automated, and significant labor saving was achieved. FSF also allows factories to entrust even new workers with managing production lines, with less time required for passing on know-how to new workers.

Online seminars

The contribution Fuji automation makes to SMT lines that do not stop and the improvement and reform of production sites

While there is a need to maintain production and further improve efficiency, it is becoming increasingly difficult to secure personnel with the necessary skills due to a chronic shortage of human resources as well as issues related to the mobilization of human resources. Using actual examples, we will explain how FUJI Smart Factory solutions help to maximize production efficiency while alleviating human resource shortages by reducing workloads through automation of tasks, and by increasing work efficiency through system support.

The contribution Fuji pick and place machines make to surface mounting technology and the improvement and reform of production sites

Against a backdrop of demand for product miniaturization and minimization of occupied spaces, the instances of parts being placed at high-density, ultra-small chip parts, and small CSPs with fine bumps are increasing. On the other hand, there is also demand for larger BGAs and larger panels to enable higher functionality and function integration. This presentation will explain how Fuji’s pick and place machines cater to the simultaneously advancing diversification of electronic panels and increasing difficulty in parts placement processes due to a higher level of sophistication.

The contribution Fuji printers make to printing technology and the improvement and reform of production sites

Electronic panels are evolving to cater to a wide range of applications, including larger panels for cloud computing and AI services, ECU panels such as those for inverters for automotive applications, and thinner panels for SiP and package manufacturing. As panels become more diverse and sophisticated, with greater complexity, the difficulty presented when solder printing on these panels also increases. The workload associated with changeover also increases. We will introduce how Fuji’s printers help to improve these circumstances surrounding solder printing and ensure stable printing.

Indispensable sensing technology for preventing defective boards

Electronic devices such as smartphones and home appliances are becoming more sophisticated every year, with new functions constantly being added. Accordingly, the quantity of parts being placed on electronic panels is increasing, especially passive components, and their size is also decreasing, making it more difficult than ever before to maintain quality. Focusing on the quality aspect of the placement process, this webinar will explain in detail the various functions that maintain quality during production using pick and place machines for processes during which people are unable to intervene, using CG animation that reproduces the inside of the latest NXTR pick and place machine in great detail.

The latest surface mount technology for supporting connected societies

We will introduce the pick and place machine AIMEXR, which has been developed to realize stable production from NPI to mass production flexibly and at high speed.

Where are we at now with Fuji Smart Factory?

FUJI Smart Factory that maximizes production. We will introduce the full picture and the current position of FUJI Smart Factory 2.0 aiming further evolved automation and laver saving.

Addressing fine pitch placement and heavy part placement with NXTR

In this seminar we are demonstrating how the NXTR meets the needs of current market trends such as fine pitch placement of small parts, as well as the placement of large and heavy parts. Demonstrations use actual equipment.

Automating all insertion processes including pre-processing – Fuji’s automated solutions for insertion processes

we will introduce solutions for automation of parts insertion on the Multipurpose Automated Fabrication Machine – sFAB-D, focusing on automatic supply of loose-supplied parts and large connectors, which are often an obstacle to improving the automation rate and reducing workloads at the production line.

Learn fast, act quickly – Factory improvement solutions

In recent years, digital transformation solutions have been introduced to many production sites and monitoring tools that visualize the status and progress of production lines have also been introduced. So why is it that so many customers still seem to find issues in productivity? We would like to introduce IPQC Expert, which is great at error prevention.

The Road to Insertion Process Automation – The Keys to Success and Fuji Solutions –

For customers considering the introduction of robots to automate insertion processes, we will talk about the check points when introducing robots from the perspective of a robot manufacturer.

The Road to Insertion Process Automation – sFAB –

We will introduce solutions using the cartesian robot type insertion machine sFAB, which is currently the mainstream insertion machine for large and odd-form parts by examining three key phrases: Automation rate, versatility, and production quality.

The Road to Insertion Process Automation – SmartWing BA –

We will introduce the features of our newly released Panel Assembly Robot Cell SmartWing BA under the theme of "Easier to use" with demonstration videos showing what kind of production matches this machine.

Large part placement solutions

With the full-scale operation of 5G started and the development of automated driving technology underway, we will cover the demands on placement and introduce large part placement solutions (placing DIMM sockets, 1.5 inch tall parts, and 250 g heavy parts) for the NXT III series and AIMEX III series using videos. Finally, we will also introduce the capability of the new NXTR to handle large parts.

Printing issues and how to solve them through automation

Solder printing becomes more difficult the greater the part density is on electronic panels, and a high level of management is required. However, the results can vary greatly depending on the environment inside the machine. Solder printing quality often relies on the knowhow of the operator, and it is a difficult process to standardize. This seminar focuses on issues that stem from operator-dependent tasks in solder printing, and introduces ways that automation can resolve these.

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