Low impact placement
Solutions for issues in high density placement – Introducing the placement height adjustment function
The annual amount of data generated by the world's IoT devices is increasing every year, and the accompanying electricity consumption for data storage is expected to reach about 15% of the world's total electricity generation by 2030. Meanwhile, energy saving is an important issue for achieving SDGs and carbon neutrality and there is demand for smaller and higher-density panels that are used in all electronic devices, from mobile devices to automotive electronics, communication infrastructure, and servers. To achieve this, stable placement quality must be maintained in production using panels designed for space saving and economical wiring. This article introduces the placement height adjustment function, one of the solutions available for resolving issues in high density placement.
Placement Solutions for Packages Including SiP and Other Module Parts
Fuji provides an array of solutions for manufacturing SiP and other module parts. We will be looking at solutions for higher density placements and thinner structures using Fuji functions and units.
Maintaining High Quality amid Changes in SMT for Increasingly Complex Electronic Panels
This article will cover three areas that are important to improving quality in SMT processes and maintaining a high level of QCD, "Sure-fire pickup and placement", "Eliminating defective materials", and "Proper maintenance" with supporting data.