Solder ball placement solutions | Enables solder ball placement with SMT equipment
Home > Useful Information > Solder ball placement solutions | Enables solder ball placement with SMT equipment
In recent years, the electronics manufacturing industry (EMS and electronics manufacturers) has begun to produce Ball Grid Arrays (BGAs) in-house, rather than relying on procurement from external manufacturers.
However, dedicated solder ball placement machines are expensive and the high cost of introducing equipment, such as the need for SPI machines (solder ball inspection machine) to check for missing placements remains a major issue.
Fuji offers solder ball placement solutions that do not require dedicated machines to resolve these issues.
Without introducing dedicated machines, simply loading dedicated units on NXTR S model placement machines enables one-stop processing from batch solder ball placement to inspection and replenishment.
Fuji's solder ball placement process
Solder ball placement can be performed by loading dedicated units on the NXTR S model.
Step 1. Batch supply and placement
Solder balls are picked and placed in batches using solder ball supply units and dedicated nozzles.
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Step 2. Placement inspection (MPI function)
Missing solder ball placements are automatically detected after placement by the MPI function on the NXTR.
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Step 3. Additional placement
For detected missing locations, additional placement is performed individually using a vibratory array feeder.
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Three benefits that support in-house BGA production
1. Ensures high quality through inspection and replenishment
NXTR inspection function automatically detects missing solder ball placements.
By performing additional placement at the detected locations, high quality production with minimal waste can be achieved.
2. Minimizes initial costs without requiring dedicated machines
Solder ball placement can be introduced with minimal investment because dedicated machines and inspection machines are not required.
Solder ball placement can be performed just by loading dedicated units on the NXTR S model.
3. Maximizes operating rates by using together with standard placement
When solder ball placement is not being performed, that NXTR machine can be used as a standard placement machine.
By supporting a wide range from BGA production to panel placement, the operating rates of production equipment can be maximized.
Fuji's solder ball placement solutions are innovative solutions that combine high quality, low cost, and high versatility.
This is a new option for companies considering in-house BGA production.
Check the member-exclusive material for details.
