High density placement
Placing parts with high accuracy
In addition to the advancement of smaller electronic parts and more complex electronic circuit designs, growing needs for finer pitch placement is making filletless soldering more popular. A small amount of solder is applied when performing fine pitch placement using very small sized chip parts, which makes it difficult to expect such parts to be applicable for self-alignment effects. Instead, producing accurate part placement to put parts in a definitive place is required.
The following introduces positioning techniques for achieving highly accurate placement.